| BQFP | Bumpered Quad Flat Pack |
| CAV.BGA | Cavity Ball Grid Array |
| CBGA | Ceramic Ball Grid Array |
| CDIP | Ceramic Dual In-line Package |
| CERDIP | Ceramic Dual In-line Package. This is a hermetic package consisting of two pieces of dry pressed ceramic surrounding a "dip formed" leadframe. |
| CERPAK | Construction is similar to Cerdip, however the leads are in a "flat unformed" configuration. This package can have leads extending from two sides of the package (dual) or extending from four sides of the package. |
| Chip Scale Packaging | Also known as "chip size packaging": a high-density packaging process that approximates the size of the chip itself and has a bigger (>50%) chip/package area ratio. |
| COB | Chip On Board |
| CPGA | Ceramic Pin Grid Array |
| CQUAD | Ceramic Quad Package ("J") Form Leads |
| CQFP | Ceramic Quad Flat Pack |
| DCA | Direct Chip Attach |
| DIP | Dual In-line Package |
| Epoxy Seal | A method of non-hermetically sealing a lid to a package with cured epoxy material. |
| Flip Chip | A semiconductor chip that is flipped (face down) and connected for package, substrate or board. The chip typically has bumps (on the bond pads) in a peripherial or array design. |
| Frit Seal | A method of hermetically sealing a ceramic lid to a ceramic package with reflowed glass. |
| LDCC | Leaded Chip Carrier (Ceramic) |
| LLCC | Lead Less Chip Carrier |
| MBGA | Metal Ball Grid Array developed by Olin Interconnect |
| mBGA | Micro Ball Grid Array developed by Tessera Corp. |
| MCM-PBGA | Multi-Chip Module-Plastic Ball Grid Array |
| MCP | Multi-Chip Packaging |
| MQFP | Metric Quad Flatpack |
| MQUAD | A proprietary metal QFP developed by Olin Interconnect |
| PBGA | Plastic Ball Grid Array |
| PMCM | Plastic Multi Chip Module |
| PQFP | Plastic Quad Flat Pack |
| PDIP | Plastic Dual In-line Package |
| PGA | Pin Grid Array |
| PLCC | Plastic Lead Chip Carrier |
| PWB | Printed Wired Board, also known as printed circuit board. |
| QFP | Quad Flat Pack; a surface mount package with leads on all four sides. The package body can be ceramic, metal or plastic. |
| SBGA | Super Ball Grid Array |
| Sidebraze | This through hole package consists of a co-fired ceramic base that has leads brazed on two parallel edges. |
| SIP | Single In-line Package |
| SMT | Surface Mount Technology |
| SPDIP | Shrink Plastic Dual In-line Package |
| SOIC | Small Outline Integrated Circuit |
| SOP | Small Outline Package |
| SQFP | Shrink Quad Flat Pack |
| SSOP | Shrink Small Outline Package |
| Surface Mount | A term used to describe a package whose leads or terminals are attached to the surface of the P.C. board with solder paste. |
| TAB | Tape Automated Bonding; also called Tape Carrier Packaging: Uses a flexible carrier tape, typically copper-polyimide, to connect the chip to the package, substrate or board. |
| TBGA | Tape Ball Grid Array, developed by IBM. Competes with SuperBGA. Technology is similar to TAB |
| TQFP | Thin Quad Flat Pack |
| Thru-hole | A term used to describe a package whose leads are attached through drilled holes in the P.C. board. |
| TSOP | Thin Small Outline Package |
| TSSOP | Thin-Shrink Small Outline Package |
| VQFP | Very (fine pitch) Quad Flat Pack |
| VSOP | Very Small Outline Package |
| Wire Bonding | The process of connecting the die to the leadframe substrate with very fine gold wire. |
| Zip | Zip-Zag In-line package. Similar to SIP configuration, the leads are formed in a "zig-zag" fashion. |